In backend LED sorting process, as the blue tape that is stuck beneath the LED chip is peeled off, because the bottom pin needs to be re-positioned to the film on top to allow the LED chip that is to be sucked away to be removed by the upper suction pod. During high-speed movement, the impact strength of the upper pin may be too strong, causing the LED chip to crack. In addition, to shorten the motion cycle period, the swing arm must conduct short, high-speed movements, which involve rapid acceleration/deceleration. To ensure that the mechanism can endure these vibrations, most machines decrease the speed and consequently decrease throughput. The term Backend refers to dicing the wafer into individual chips and all the processes thereafter; such as test, assembly and packaging. The goal of inline packaging inspection equipment is to provide high precision 100% analysis while maintaining high throughput.