In manual electronics manufacturing processes that require the application of adhesives, it generally takes double the effort to complete in comparison to when automated dispensers are used. When traditional adhesive dispensers are used, the process involves using contact-type dispensers to apply adhesives to such surfaces as electronic components and LED packaging.
However, with miniaturization of products, these traditional dispensers can no longer be used. High-speed automated adhesive dispensers that provide accurate flow control as well as high-precision and contactless application are instead required for the forming of often micro-sized points, lines and other shapes.
The customer required an automated adhesive dispensing system comprising pneumatic machines, image processors, I/O modules and Internet communication control modules.
Industrial computers were needed to integrate motor drivers, adhesive dispenser and high-speed cameras. The dispensing system had to maintain stable adhesive control and trajectory planning. During operation, this not only includes controlling the pneumatic cylinder but also monitoring the environmental temperature and signals from various sensors. Once dispensing is completed, the system needed to confirm that the adhesive had been applied correctly to the surface via machine visual inspection.
To ensure precise multi-task motion control and accurate image inspection, an IPC-631 chassis and AIMB-705 motherboard (Core-i3 CPU) were adopted as the industrial PC and a PCI-1756 high-speed I/O card was installed to connect to pneumatic components in order to control the electromagnetic valves and acquire signal data.
A PCI-1245 4-axis DSP-based motor control card was considered ideal for the server motor controllers because it has reserved memory for trajectory planning and a maximum pulse output of 5 Mbps. It also supports Advantech's Common Motion API, which enables the customization of trajectories with linear and arc functions while controlling the dispensing nozzles with PWM, thereby being able to set the output volume according to the nozzle cycle (referring to the time between opening and closing the nozzle). Intricate coating patterns could thus be achieved by controlling the distribution via speed limitations. Specifically, the dispenser valve and adhesive amount could be managed at jetting speeds of 100~200 Hz and the spacing could be controlled by adjusting the nozzle’s movement speed.
- IPC-631: 4U Short Depth Front I/O Chassis
- AIMB-705: Industrial ATX Motherboard Supporting 6th/7th Gen. Core i
- PCI-1756: 64-ch Isolated Digital I/O
This PCB equipment interconnectivity demonstrated the operation of Advantech's products as key components in each layer of the system, including data acquisition from the lower layers transformation of various PLC data formats and the distributed structure motor control and visual image acquisition; mid-layer computing platform and data integration; and the critical step of cloud data format management and enterprise database integration.
In addition to being mutually compatible, these layers were easy to develop. With particular regard to the computation layer, WISE-PaaS was invaluable in providing a flexible development platform, and Advantech's support in assisting with the development enabled the customer to work with each handler and the RESTful API data format, thus completing highly customized on-site information integration with the extent database.
The customer was able to complete a product demonstration in less than a year and then replicated this system in other mass production lines thus increasing production efficiency via equipment interconnectivity.